FACTBOX-A look inside Apple's new iPhone 5S
MELBOURNE/SAN FRANCISCO, Sept 19 (Reuters) - Apple Inc's newest smartphone models hit stores on Friday in many countries across the world, including Australia and China. The gadget giant for the first time is selling a second smartphone dubbed "5C" featuring a plastic back and bright colors. The pricier "5S" now comes in three new colors - gray, silver and gold.
Technology firm iFixit disassembled a gold-colored iPhone and examined its parts. Following are some of the key components for the iPhone 5S and their makers that have been identified so far:
-- Chips from Avago, Skyworks Solutions are featured in the new iPhone. Companies supplying parts for the new phone also include memory chipmaker Hynix and radio-frequency chipmaker Triquint
-- The new fingerprint sensor uses a chip from NXP Semiconductors
-- There is no single M7 motion co-processor, a new chip that Apple said was part of the iPhone 5S when it unveiled the device last week. The M7 appears to be more a collection of chips, including chips for a gyroscope, accelerometer and compass, iFixit said.
-- Broadcom's BCM5976 chip is used for touchscreen controller.
-- Murata Manufacturing Co's 339S0205 (based on the Broadcom BCM4334) is used in Wi-Fi module.
-- Includes chips from Qualcomm Inc (PM8018 RF power management IC) and Texas Instruments Inc.
Information is from iFixit, a Web site offering parts and self-repair guides for iPods and Macintosh computers. The company, which has conducted similar "tear downs" on other Apple products, posted step-by-step photos of the process on its Web site at: http://www.ifixit.com/Teardown/iPhone+5s+Teardown/17383/1?singlePage
(Reporting By Richard Pullin and Poornima Gupta; Editing by Matt Driskill)