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USB 3.0 - Global Strategic Business Report 2013 Featuring Both USB Chip Manufacturers and USB 3.0 Enabled Device Manufacturers

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Dublin, Oct. 9, 2013 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/k3wwl8/usb_3_0_global) has announced the addition of the "USB 3.0 - Global Strategic Business Report" report to their offering.

This report analyzes the worldwide markets for USB 3.0 in Million Units. The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World. Annual estimates and forecasts are provided for the period 2011 through 2018. Also, a six-year historic analysis is provided for these markets.

The report profiles 82 companies including key USB Chip Manufacturers such as:

  • ASMedia Technology Inc.
  • Advanced Micro Devices Inc.
  • Cypress Semiconductor Corporation
  • DisplayLink Corporation
  • Etron Technology Inc.
  • Faraday Technology Corporation
  • Fresco Logic Inc.
  • Fujitsu Limited
  • Intel Corporation
  • LucidPort Technology Inc.
  • PLX Technology Inc.
  • Renesas Electronics Corporation
  • Standard Microsystems Corporation
  • Synopsys Inc.
  • VIA Technologies Inc.
  • Texas Instruments.

The report also profiles major USB 3.0 Enabled Device Manufacturers such as:

  • Apple Inc.
  • ELECOM Co Ltd.
  • LaCie S.A.S
  • Hewlett-Packard Company
  • Iomega
  • Kingston Technology Company
  • Micron Consumer Products Group Inc.
  • SanDisk Corporation
  • Seagate Technology LLC
  • Toshiba Corporation
  • Transcend Information Inc.


Key Topics Covered:

I. Introduction, Methodology & Product Definitions

  • Study Reliability and Reporting Limitations I-1
  • Disclaimers I-2
  • Data Interpretation & Reporting Level I-2
  • Quantitative Techniques & Analytics I-3
  • Product Definitions and Scope of Study I-3

II. Executive Summary

1. INDUSTRY OVERVIEW II-1

  • A Prelude II-1
  • Performance Benefits to Boost USB 3.0 Penetration Rates II-1
  • Efficient Battery Maintenance - Business Case for USB 3.0 II-2
  • Backward Compatibility to Assist Seamless Transition from USB 2.0 to USB 3.0 II-3
  • Growing Demand for USB 3.0 Interface to Benefit USB 3.0 Chips Market II-3
  • Current & Future Analysis II-4
  • PC Segment - The Early Revenue Contributor II-4
  • Opportunity Indicator II-4
  • Portability of Electronic Devices to Lend Traction to USB 3.0 II-5
  • USB 3.0 Flash Drives Make the Cut in Storage Market II-5
  • Opportunity Indicator II-6
  • USB 3.0 Enabled High-Bandwidth Storage Devices - A Major Draw II-7
  • Consumer Entertainment & Communication Devices to Follow Suit II-7
  • Mobile Phones - The Next Frontier II-7
  • Opportunity Indicators II-8
  • Smartphones & Tablet PCs - The Next Frontier II-9
  • Declining Costs to Drive Volume Sales II-11
  • 'Thunderbolt' - How Big is the Threat? II-11
  • USB 3.0 Host ICs Market to Become More Competitive II-12
  • USB 3.0 chipmakers Turn to USB hub business II-12

2. PRODUCT OVERVIEW II-13

  • What is USB 3.0? II-13
  • USB 2.0 vs. USB 3.0 II-13
  • USB 3.0 Enabled Devices II-14
  • USB 3.0 Chipsets II-14
  • Methods of Upgrading Legacy Laptops with USB 3.0 Support II-14
  • Features of USB 3.0 II-14
  • Faster Transfer Speeds II-14
  • Factors Attributing to Speed Disparities in USB 3.0 Equipment II-15
  • Separate Data Lanes for Uploads and Downloads II-15
  • Quicker Charging of Devices II-15
  • Increased Power Efficiency II-15
  • Backward Compatibility II-15
  • USB 3.0 Connectors II-16
  • USB 3.0 Standard-A Connectors II-16
  • USB 3.0 Standard-B Connectors II-16
  • USB 3.0 Powered-B Connectors II-16
  • USB 3.0 Micro Connectors II-16
  • USB 3.0 Micro-B Connectors II-16
  • USB 3.0 Micro-AB and USB 3.0 Micro-A Connectors II-17
  • Architecture II-17
  • Physical Layer II-17
  • Data Encoding/Decoding in USB 3.0 II-17
  • Link Layer II-17
  • Protocol Layer II-18
  • Operating Systems Supporting USB 3.0 II-18
  • Linux OS II-18
  • Windows XP, Vista & 7 II-18
  • Windows 8 II-18
  • Mac OS X II-19
  • Disadvantages II-19

3. STRATEGIC CORPORATE DEVELOPMENTS II-20

  • Fresco Logic Launches FL2000 USB-Device Display Controller II-20
  • Plugable Technologies Introduces USB 3.0 to HDMI/DVI Graphics Adapter II-20
  • DisplayLink Launches Fujitsu USB 3.0 Port Replicator PR08 II-20
  • L-com Introduces USB 3.0 Female Bulkhead Cables II-21
  • Etron Technology to Launch Three USB 3.0 IC Controllers II-21
  • Lexar Introduces JumpDrive Series High-Speed USB 3.0 Flash Drives II-21
  • Toshiba America Information Systems Launches Dynadock USB 3.0 Hub II-22
  • Tokyo Electron and Cypress Semiconductor Jointly Develop USB 3.0 Device Interface Card II-22
  • Microsoft Selects Cypress's EZ-USB FX3 USB 3.0 Controller II-23
  • XIMEA Launches MQ Series Industrial Camera with Cypress Semiconductor FX3 Controller II-23
  • Targus Unveils ACP70US USB 3.0 SuperSpeed™ Dual Video Docking Station II-24
  • FRAMOS Unveils USB 3.0 Super-Speed Interface for Visiosens VFU Camera Platform II-24
  • Kingston Digital Introduces USB 3.0 Media Reader II-25
  • Renesas Electronics Unveils SuperSpeed USB SATA3 Bridge System-on-Chip II-25
  • NXP Semiconductors Launches PTN36241B USB 3.0 SuperSpeed Redriver II-25
  • Super Talent Technology Unveils DataGuardian USB 3.0 Flash Drive II-26
  • US Robotics Launches Multi Slot Card Reader/Driver II-26
  • Cypress Semiconductor Launches West Bridge Benicia Peripheral Controller II-26
  • Exar Launches XRP252x Series of Power Distribution Devices II-27
  • DisplayLink Unveils DL-3000 Controller Chip Platform II-27
  • Parade Technologies Launches PS8720 Dual USB 3.0 Repeater/ Redriver II-28
  • Himax Technologies Launches USB 3.0 Pico-Projector Solution II-28
  • Testronic Selects Ellisys Explorer™ 280 System of Ellisys II-29
  • Kingston Technology Company Launches USD 3.0 HyperX Max External Hard Drive II-29
  • Kingston Technology Company Launches DataTraveler Ultimate 3.0 II-29
  • Newer Technology Launches USB 3.0 Universal Drive Adapter II-30
  • Parade Technologies Launches PS8710 USB 3.0 with Least Power Repeater/Redriver IC II-30
  • Blackmagic Design Introduces New USB 3.0 Real-Time 1080p Video Editing Solution II-30
  • TRENDnet Introduces USB 3.0 External Enclosures II-30
  • Iomega Introduces USB 3.0 External SSDs II-31
  • LaCie Releases Rikki and Minimus USB 3.0 Hard Drives II-31
  • Belkin International Unveils SuperSpeed USB 3.0 Product Range II-31
  • LeCroy Launches Advisor T3 USB 3.0 Protocol Analyzer II-31
  • Addonics Technologies Rolls Out eSATA Converter II-31
  • SIIG Introduces Two SuperSpeed USB 3.0 Hubs II-32
  • ASMedia Collaborates with MCCI® II-32

4. FOCUS ON SELECT GLOBAL PLAYERS II-33

  • Chip Manufacturers II-33
  • ASMedia Technology, Inc. (Taiwan) II-33
  • Advanced Micro Devices, Inc. (US) II-33
  • Cypress Semiconductor Corporation (US) II-33
  • DisplayLink Corporation (US) II-33
  • Etron Technology, Inc. (Taiwan) II-34
  • Faraday Technology Corporation (Taiwan) II-34
  • Fresco Logic, Inc. (US) II-35
  • Fujitsu Limited (Japan) II-35
  • Intel Corporation (US) II-35
  • LucidPort Technology, Inc (US) II-36
  • PLX Technology Inc (US) II-36
  • Renesas Electronics Corporation (Japan) II-36
  • Standard Microsystems Corporation (US) II-37
  • Synopsys, Inc. (US) II-37
  • VIA Technologies, Inc. (Taiwan) II-38
  • Texas Instruments (US) II-38
  • USB 3.0 Enabled Device Manufacturers II-39
  • Apple Inc. (US) II-39
  • ELECOM Co Ltd (Japan) II-39
  • LaCie S.A.S (France) II-39
  • Hewlett-Packard Company (US) II-40
  • Iomega (US) II-40
  • Kingston Technology Company (US) II-40
  • Micron Consumer Products Group, Inc (US) II-41
  • SanDisk Corporation (US) II-41
  • Seagate Technology LLC (Ireland) II-41
  • Toshiba Corporation (Japan) II-42
  • Transcend Information, Inc (Taiwan) II-42

5. GLOBAL MARKET PERSPECTIVE II-43


III. Market

1. The United States

2. Japan

3. Europe

4. Asia-Pacific

5. Rest Of World

IV. Competitive Landscape

Total Companies Profiled: 82 (including Divisions/Subsidiaries - 95)

  • The United States (52)
  • Canada (2)
  • Japan (7)
  • Europe (9)
  • - France (2)
  • - The United Kingdom (4)
  • - Rest of Europe (3)
  • Asia-Pacific (Excluding Japan) (12)

For more information visit http://www.researchandmarkets.com/research/k3wwl8/usb_3_0_global

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Computing

Source:Research and Markets