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STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis

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Dublin, Oct. 21, 2013 (GLOBE NEWSWIRE) -- Research and Markets
(http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the new 9-DOF IMU supplied by STMicroelectronics.

The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope, a 3-axis accelerometer and a 3-axismagnetometer.

ST achieves to obtain this package footprint by combining the 3-axis gyroscope and the 3-axis accelerometer function on the same die. This new structure, combined with an Au-Au hermetic bonding process allow ST's to shrink the 6-axis function by more than 35%.

The LSM333D is targeted for portable applications: indoor navigation, smart user interface, advanced gesture recognition, gaming and virtual reality input device It provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic field).

This report provides complete teardown of the 9-Axis IMU with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Key Topics Covered:

Overview / Introduction
Executive Summary
Reverse Costing Methodology

Companies Profile

Physical Analysis

  • Package X-Ray
  • Package Opening
  • Package Cross-Section
  • ASICs Dimensions
  • ASICs Delayering
  • ASICs Cross-Section
  • MEMS Gyro/Accelero Dimensions
  • MEMS Gyro/Accelero Cap Opening
  • MEMS Gyro/Accelero Sensing Areas
  • MEMS Gyro/Accelero Cross-sections
  • X/Y-Axis Magnetometer Dimensions
  • X/Y-Axis Magnetometer Delayering
  • X/Y-Axis Magnetometer Cross-section
  • Z-Axis Magnetometer Dimensions
  • Z-Axis Magnetometer Delayering
  • Z-Axis Magnetometer Cross-section

Manufacturing Process Flow

  • Front-End Manufacturing Process Flows
  • Description of the Wafers Fabrication Units
  • Back-End Packaging Process Flow
  • Back-End Packaging Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASICs Wafer Cost
  • ASICs Die Cost
  • MEMS Gyro/Accelero Wafer Cost
  • MEMS Gyro/Accelero Die Cost
  • X/Y-Axis Magnetometer Wafer Cost
  • X/Y-Axis Magnetometer Die Cost
  • Z-Axis Magnetometer Wafer Cost
  • Z-Axis Magnetometer Die Cost
  • Back-End: Packaging Cost
  • Back-End: Final test & Calibration Cost
  • LSM333D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

  • Manufacturer Financial Ratios
  • LSM333D Estimated Selling Price


For more information visit http://www.researchandmarkets.com/research/7w9xr4/stmicroelectronics

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
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Sector: Telecommunications and Networks

Source:Research and Markets