IRISYS REDEYE-6A Pyroelectric Array Sensor Reverse Costing Analysis

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Dublin, Oct. 22, 2013 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/nfnv4z/irisys_redeye6a) has announced the addition of the "IRISYS REDEYE-6A Pyroelectric Array Sensor Reverse Costing Analysis" report to their offering.

IRISYS (Infrared Integrated Systems Ltd), Northampton, UK, is promoting thermal technology for intelligent building. Using its own thermal imaging cameras, the company has developed a range of innovative solutions from people counting to security.

The REDEYE-6A is an array sensor using pyroelectric ceramic. The manufacturing process is simpler than it is for a micro-bolometer. The ceramic plate is attached on top of the readout integrated circuit and sealed with the IR window.

The definition of the REDEYE-6A is rather low: 31x31 pixels. It is optimized for low-cost application which do not need a great definition and high refresh rate. The same pyroelectric ceramic technology is used for higher definition array sensor, up to 47x47 pixels.

Key Features

  • The REDEYE-6A is a low cost thermal imaging IR sensor
  • Using a ceramic pyroelectric array
  • Extracted from the Dewalt DCT416 imaging thermometer

Key Topics Covered

1. Overview / Introduction

2. Company Profile

3. Physical Analysis

  • Synthesis of the Physical Analysis- IR Camera DCT416
  • Package
  • IR Window
  • Bonding
  • Read Out IC
  • Principle Operation
  • ROIC Functions
  • Pixels
  • ROIC technology
  • Pyroelectric Ceramic
  • IRISYS Patents
  • Electrodes
  • Pyroelectric Ceramic Material
  • Physical data summary

4. Manufacturing Process Flow

  • Global Overview
  • ROIC Process Flow
  • Description of the ROIC Wafer Fabrication Unit
  • Pyroelectric Ceramic Process Flow
  • Pyroelectric Array Process Flow
  • Packaging

5. Cost Analysis

  • Main Steps of Economic Analysis
  • Yields Explanation
  • Die per wafer & Probe Test
  • ROIC Wafer Front-End Cost
  • Pyroelectric Ceramic Wafer Cost
  • Pyroelectric Array Wafer Cost
  • Equipment Cost
  • Consumable Cost
  • Back-End 1 : Packaging, Final test
  • Component Cost (FE + BE 0 + BE 1)
  • Yields Synthesis

6. Pyroelectric array Price Estimation

  • Manufacturer Financial Ratios
  • Estimated Manufacturer Price
  • Synthesis of the cost analysis

For more information visit http://www.researchandmarkets.com/research/nfnv4z/irisys_redeye6a

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