Texas Instrument DLP PicoTM projector family - Reverse Costing Report

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Dublin, Oct. 22, 2013 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/ftxtdk/texas_instrument) has announced the addition of the "Texas Instrument DLP® PicoTM projector family - Reverse Costing Report" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of three DLP® Pico projectors (DLP® nHD, DLP® 0.17 HVGA and the DLP® 0.3 WVGA) supplied by Texas instrument.

Featuring a nHD resolution (640 x 360) and packaged in a small ceramic housing (16mm x 6.9mm), The DLP nHD, is the thinnest and the smallest DLP Pico projector. It is ideally suited for mobile application and was extracted from the Galaxy beam phone.

The DLP1700, features a Half-VGA Resolution (480 x 320), and has a 0.17-Inch Micromirror Array Diagonal, while the DLP3000 features a Wide-VGA Resolution (608 × 684) and has a 0.3-Inch Micromirror Array Diagonal.

Both of them, are ideally suited for Pocket Projectors and were extracted from Optima devices.

Key Topics Covered:

Overview / Introduction

Texas instrument Company Profile

Physical Analysis

  • Synthesis of the Physical Analysis
  • DLP® 0.17 HVGA: Package Characteristic
  • DLP® 0.17 HVGA: Package Opening
  • DLP® 0.17 HVGA: Package Cross Section
  • DLP® 0.17 HVGA: Process technology
  • DLP® 0.17 HVGA: Micromirrors-Pictures
  • DLP® 0.3 WVGA: Package Characteristics
  • DLP® 0.3 WVGA: Package Opening
  • DLP® 0.3 WVGA: Package Cross Section
  • DLP® 0.3 WVGA: Process technology
  • DLP® 0.3 WVGA: Micromirrors-Pictures
  • DLP® nHD: Package Characteristics
  • DLP® nHD: Package Opening
  • DLP® nHD: Package Cross Section
  • DLP® nHD: Process technology
  • DLP® nHD: Micromirrors-Pictures

Manufacturing Process Flow

  • Wafers Fabrication Units
  • Front-End Manufacturing Process Flow:
  • Back-End Packaging Process Flow
  • Back-End Packaging Assembly Unit

Cost Analysis

  • Synthesis of the Cost Analysis
  • CMOS Wafer Front-End Cost
  • CMOS Die Cost
  • MEMS Wafer Front-End Cost
  • MEMS Front-End Cost per Steps
  • MEMS Front-End Cost per Equipment
  • MEMS Front-End Cost per Consumables
  • MEMS Die Cost
  • Back-End : Package Cost
  • Back-End : Package Cost Per Steps
  • Manufacturing Cost

Estimated Manufacturer Price

For more information visit http://www.researchandmarkets.com/research/ftxtdk/texas_instrument

Research and Markets
Laura Wood, Senior Manager.
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Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks

Source:Research and Markets