SUNNYVALE, Calif., March 3, 2014 (GLOBE NEWSWIRE) -- Applied Micro Circuits Corporation (Nasdaq:AMCC), also known as AppliedMicro, today announced the Multi-Link Gearbox II (MLG), the first of its kind, designed to significantly lower the cost and complexity of interconnects for next-generation cloud computing and data center environments. The second generation Gearbox from AppliedMicro is the newest member of its X-Weave™ product family and the world's first Optical Internetworking Forum (OIF) and MLG compliant device. The Gearbox II comes in two device variants:
- S28110PRIA1 – 100Gbps Multi-Rate Gearbox with 10 lane bypass for Ethernet and OTN
- S28115PRIA1 – 100Gbps Multi-Link Gearbox with 10 lane bypass
In a port expander application using MLG, the S28115PRIA1 enables switch or NPU ASICs with a 4 x 25Gbps interface to connect seamlessly with legacy 10GE ports. MLG also facilitates fiber-efficient rack-to-rack interconnect in the data center. By transporting up to ten 10GE links on a single cable, data center operators can reduce the burden and cost of managing multiple interconnects. Multi-Link Gearbox enables moving the 10G SFP+ cages from the faceplate of routers and switches to dedicated shelves, freeing up valuable faceplate real estate.
"At our recent Linley Tech Data Center Conference, AppliedMicro showed an X-Gene™ scale-out solution using an MLG Gearbox to aggregate 10G Ethernet to 100G Ethernet," said Bob Wheeler, Principal Analyst at The Linley Group. "With increasing pressure on both front-plate density and switch-ASIC pin counts, particularly in data centers, we expect to see double-digit annual growth in MLG shipments."
"The need for reduced power consumption, lower cost and higher port density continues to drive interest in our Gearbox products," said Francesco Caggioni, Senior Director of Marketing & Technology, AppliedMicro. "Data center and access network developers have made multi-rate and multi-link must-have features for this product category, and we are thrilled to meet this market demand on the heels of the OIF-ratified standard."
AppliedMicro will showcase its X-Weave™ Multi-Link Gearbox technology in a live demo in its booth, No. 3071, at OFC 2014, taking place at the Moscone Center in San Francisco from March 11-13.
Applied Micro Circuits Corporation is a global leader in computing and connectivity solutions for next-generation cloud infrastructure and data centers. AppliedMicro delivers silicon solutions that dramatically lower total cost of ownership. Corporate headquarters are located in Sunnyvale, California. www.apm.com.
Applied Micro Circuits Corporation, AppliedMicro, X-Weave, and X-Gene are trademarks or registered trademarks of Applied Micro Circuits Corporation. All other product or service names are the property of their respective owners.
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Source:Applied Micro Circuits Corporation