NXP Launches Premium Sound for Every Phone

EINDHOVEN, Netherlands, Dec. 2, 2014 (GLOBE NEWSWIRE) -- NXP Semiconductors (Nasdaq:NXPI) has launched its third-generation smart amplifier for smartphone audio systems – the TFA9897. The world's smallest smart-amplifier solution, the TFA9897 makes the industry's leading speaker-protection solution available to all phones at an affordable price – further demonstrating NXP's commitment to developing innovative and accessible solutions for the fast-growing Portable & Wearable market.

NXP introduced the world's first smart amplifier in 2012. Since its introduction, the overwhelming majority of leading smartphone manufacturers have adopted NXP speaker-protection solutions to improve the sound quality and volume provided by their devices. The high demand for NXP smart amplifiers has resulted in NXP shipping more than 150 million smart-amplifier ICs in just 2.5 years.

The global proliferation of smartphones combined with increasing consumer demand for high-quality sound is driving significant market demand for smart amplifiers. In addition to enhancing sound quality and volume, NXP smart amplifiers also address the new acoustic challenges created by thinner and smaller handsets as well as the repositioning of the speakers on the front of the phones.

"Over the past year, smart amplifiers have become the standard for premium smart phones. All top 15 smartphone makers use some form of speaker protection," said Shawn Scarlett, marketing director, Mobile Audio Solutions, NXP Semiconductors. "NXP is the clear market leader in smart amplifiers. We ship to 13 of the top 15 OEMs, including all of the top 10 OEMs in China. Our solutions can be found enhancing audio in the most sought after phones on the market today."

The TFA9897 is designed to bring premium performance to mainstream phones. The TFA9897 features the latest version of NXP's industry-leading algorithm, which is embedded in a system optimised for 8ohm micro-speakers. As with previous smart-amplifier ICs, the entire system is integrated into a single chip which features the CoolFlux DSP, a high-efficiency class-D amplifier with current sensing and a DC-to-DC converter. The turn-key solution is compatible with all platforms and is easy to integrate.

Unlike simple current sense amplifiers, the TFA9897 offers the lowest latency protection available, making it capable of competing with other amplifiers that feature higher power ratings.

The advanced, embedded algorithms require no separate licensing. Additional tools allow designers to customise sound quality and choose how to optimise the phone's performance. The design-in activities are supported by the world's strongest dedicated field application team. NXP's expert field application team is distributed globally and offers world-leading expertise across hardware, software and acoustics.

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. Find out more at www.nxp.com.

Forward-looking statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

CONTACT: For further press information, please contact: NXP Semiconductors Europe: Martijn van der Linden +31 6 10914896 martijn.van.der.linden@nxp.com Greater China / Asia: Esther Chang +886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors