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Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Technology Analysis

Dublin, Dec. 11, 2014 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/sbff79/wolfson_wm7121) has announced the addition of the "Wolfson WM7121 & WM7132 - Top & Bottom Port MEMS Microphones Technology Analysis" report to their offering.

Set of 2 Reports Highlighting MEMS And Packaging Technologies Of Wolfson Microphones

Before its acquisition by Cirrus Logic for $467M in April 2014, Wolfson Microelectronics released a series of analog and digital MEMS microphones with revenues growing 70% from 2012 to 2013.

A teardown of Motorola Moto X smartphone revealed that from the three microphones integrated two were coming from Wolfson Microelectronics, the remaining one using an Infineon technology. Wolfson's WM7121 and WM7132 are respectively top and bottom port analog MEMS microphones.

Assembled in specific LGA cavity packages, both microphones use a capacitive sensing principle based on Wolfson proprietary MEMS technology.

One of the main interest of Wolfson's MEMS technology is the use of silicon nitride (SiN) instead of polysilicon for the transducer element. According to Wolfson, silicon nitride delivers lower stress and strain coefficients, leading to higher reliability

Please note:

  • Price includes two reports
  • The Technology Analysis report provides information on Physical Analysis & Manufacturing Process Flow. A full reverse costing analysis is also available, for more information please click on the link below.


Key Topics Covered:

1. Glossary

2. Overview/Introduction, Wolfson Company Profile

2. Moto X teardown

4. Physical Analysis

Package

  • Package Views & Dimensions
  • Package Opening
  • Package Cross-Section

ASIC Die

  • View, Dimensions & Marking
  • Delayering, Process Identification
  • Cross-Section
  • Process Characteristics

MEMS Die

  • View & Dimensions
  • Marking
  • Dicing
  • Bond Pads
  • Membrane & Backplate
  • Cross-Sections

5. Manufacturing Process Flow

  • Global Overview
  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit


For more information visit http://www.researchandmarkets.com/research/sbff79/wolfson_wm7121

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Source:Research and Markets