×

Apple iPhone 5S Camera Module 8Mpixel 1.5m Stacked BSI CIS from Sony - Reverse Costing Analysis

Dublin, Dec. 12, 2014 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/czw2w5/apple_iphone_5s) has announced the addition of the "Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony - Reverse Costing Analysis" report to their offering.

For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.

The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.

This report provides a complete teardown with:

  • Detailed Photos
  • Precise Measurements
  • Material Analysis
  • Manufacturing Process Flow
  • Supply Chain Evaluation
  • Manufacturing Cost Analysis
  • Selling Price Estimation
  • Comparison with previous technology choices from Sony, Samsung and OVT


Key Topics Covered:

CAMERA MODULE SUPPLY CHAIN & COMPANIES PROFILE

Physical Analysis

Camera Module

  • Camera Module View & Dimensions
  • Camera Module X-Ray
  • Camera Module Dis-assembly

CMOS Image Sensor

  • View & Dimensions
  • Pads, Tungsten Grid
  • TSV Connections
  • CIS Pixels
  • Logic Circuit (Transistors, SRAM)

Cross-Section: Camera Module

  • Overview
  • Driver (Assembly & Process) & MLCC
  • Ceramic Substrate, IR Filter & FPC
  • Lenses, Housing, VCM

Cross-Section: CMOS Image Sensor

  • Overview
  • Pad Trenches
  • Pixel Array Circuit
  • Logic Circuit
  • TSVs

Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony


CIS MANUFACTURING PROCESS FLOW

  • Global Overview
  • Logic Circuit Front-End Process
  • Pixel Array Circuit Front-End Process
  • BSI + TSV + Microlenses Process
  • CIS Wafer Fabrication Unit
  • COST ANALYSIS
  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses

CMOS Image Sensor Cost

  • Logic Circuit Front-End Cost
  • Pixel Array Front-end Cost
  • BSI & TSV Front-End Cost
  • Color Filters & Microlenses Front-End Cost
  • Total Front-End Cost
  • Back-End: Tests & Dicing
  • CIS Wafer and Die Cost

Camera Module Assembly Cost

  • Lens Module Cost
  • VCM Actuator Cost
  • Final Cost

Camera Module Cost

For more information visit http://www.researchandmarkets.com/research/czw2w5/apple_iphone_5s


CONTACT: Research and Markets Laura Wood, Senior Manager press@researchandmarkets.com For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900 U.S. Fax: 646-607-1907 Fax (outside U.S.): +353-1-481-1716 Sector: Handsets and Mobile Devices

Source:Research and Markets