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Capella Microsystems CM3512 - Ultraviolet Light Sensor Reverse Costing Analysis

Dublin, Dec. 12, 2014 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/crfpc5/capella) has announced the addition of the "Capella Microsystems CM3512 - Ultraviolet Light Sensor Reverse Costing Analysis" report to their offering.

Historically known for its technological capabilities in optoelectronics and recently acquired by Vishay Intertechnology ($205M), Capella releases its integrated UV Sensor based on Filtron technology to provide accurate UVA/UVB light sensing.

Apple and Samsung are the first customer of this type of device.

The CM3512 is an UV sensor equipped with a photodiode, amplifiers, and analog/digital circuits into a single chip. It is designed by CMOS process and has I2C protocol interface. The use of PCB substrate enables a very compact package.

Compared with state of the art UV Sensors supplied by Rohm Semiconductor and Silicon Labs, the new design developed by Capella is based on patented Filtron Technology resin which offers reliable light-filtering capabilities into a variety of polymeric substrates.

Assembled in a OPLGA 2.35 x 1.8 x 1.0mm package, the CM3512 is an advanced sensitivity UV sensor targeted for consumers applications.


Key Topics Covered:

1. Glossary

2. Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

3, Company Profile

  • Capella Microsystems, Inc.
  • Products

4. Physical Analysis

  • Physical Analysis Methodology
  • Package Views & Dimensions
  • Package Pin Out
  • Package view
  • Package Opening
  • Package Cross-Section
  • Wire Bonding Process
  • IC Die
  • View & Dimensions
  • Marking
  • Delayering
  • IC process
  • Sensing area
  • IC cross section

5. Manufacturing Process

  • Overview
  • IC Front-End Process
  • IC Wafer Fabrication Unit
  • Packaging Process
  • Package Assembly Unit

6. Cost Analysis

  • Synthesis of the cost analysis
  • Yields Explanation
  • Yields Hypotheses
  • IC Front-End Cost
  • IC Back-End 0 : Probe Test & Dicing
  • IC Die Cost
  • Packaging Cost
  • Back-End : Final Test Cost
  • Component Cost

7. Estimated Price Analysis

  • Definition of Prices
  • Manufacturer Financial Ratios
  • Estimated Selling Price


For more information visit http://www.researchandmarkets.com/research/crfpc5/capella



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Source:Research and Markets