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Paratek - BST Tunable RF Capacitor - ON Semiconductor TCP-3027 Reverse Costing Analysis

Dublin, Dec. 12, 2014 (GLOBE NEWSWIRE) -- Research and Markets (http://www.researchandmarkets.com/research/dh9kfn/paratek_bst) has announced the addition of the "Paratek - BST Tunable RF Capacitor - ON Semiconductor TCP-3027 Reverse Costing Analysis" report to their offering.

Manufactured and sold by ON Semiconductor and based on a Paratek technology the TCP-3027 is a tunable RF capacitor of 2.7pF.

The tunable RF capacitor has a better quality factor (Q) than the standard varactor diode. The TCP-3027 is a passive tunable integrated capacitor (PTIC) packaged in a WLCSP measuring 0.87 x 0.71mm.

The tunability is due to the material called ParaScan by Paratek. A Barium Strontium Titanate (BST) doped ceramic is used as a dielectric in the capacitor. The ferroelectric characteristics of the ParaScan allows a large variation of the electric constant. Paratek has developed a specific capacitor structure and a DC bias compensation to reduce the parasitic acoustic wave.

This reverse costing report provides an estimation of the production cost of the TCP-3027. It describes the overall manufacturing process and highlights key points of innovation developed by Paratek and ON Semiconductor.


Key Topics Covered:

1. Glossary

2. Overview/Introduction, Company Profile

3. Physical Analysis

  • Synthesis of the Physical Analysis
  • Physical Analysis Methodology
  • Package
  • Package Views & Dimensions
  • Package Opening
  • Copper Pillar
  • PTIC Die
  • View & Dimensions
  • Capacitor Structure
  • Delayering
  • Cross-Sections
  • Patents
  • STMicroelectronics STPTIC

4. Manufacturing Process Flow

  • Global Overview
  • PTIC Process Flow
  • PTIC Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

5. Cost Analysis

  • Synthesis of the cost analysis
  • Main steps of economic analysis
  • Yields Hypotheses
  • PTIC Front-End Cost
  • PTIC Front-End Cost per process steps
  • PTIC Front-End: Equipment Cost per Family
  • PTIC Front-End: Material Cost per Family
  • PTIC Wafer Cost
  • PTIC - Copper Pillar
  • PTIC - Probe and Dicing Cost
  • Back-End : Final Test Cost
  • PTIC Component Cost & Price


For more information visit http://www.researchandmarkets.com/research/dh9kfn/paratek_bst

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Source:Research and Markets