NXP and Cohda Wireless RoadLINK(TM) Achieves Top Performance in Audi Field Trial for Intelligent, Securely Connected Vehicles

EINDHOVEN, Netherlands, Jan. 6, 2015 (GLOBE NEWSWIRE) -- Leading premium car brand, Audi AG, has concluded an extensive field test of NXP Semiconductors N.V. (Nasdaq:NXPI) and Cohda Wireless vehicle-to-vehicle (V2V) communications technology in Ingolstadt, Germany.

NXP, the world's first supplier to deliver V2X (vehicle-to-vehicle and vehicle-to-infrastructure) chipsets for mass-production-ready secure connected cars, and Cohda Wireless, the world's leading software supplier for IEEE 802.11p based communication, have joined forces to provide auto manufacturers with a range of 'best-in-class' V2X technologies that sets the benchmark for high performance, reliability and security.

In high speed challenges, V2V-enabled Audi vehicles equipped with the NXP RoadLINKTM chipset drove towards one another at relative speeds of up to 500 kilometers per hour, communicating across distances of more than two kilometers.

According to Audi, RoadLINKTM delivered excellent results in the reliability of wireless exchange of warnings, reception performance, and communication range in real traffic conditions and at high speeds. The RoadLINK™ chipset cut reaction time and communicated potential hazards and safety-critical scenarios significantly faster than conventional wireless technology.

The V2V tests represent another significant milestone in the strategic partnership between Audi and NXP. In 2012, NXP and Audi signed a strategic innovation partnership agreement designed to accelerate the speed of automotive innovation and time to market – including V2V communications.

Aurel Papp, head of development EMC / Antenna Components, Audi AG, explains: "The NXP RoadLINK™, chipset combined with the Delphi Automotive PLC (NYSE:DLPH) roof antenna, delivered the best results so far in our field tests. In challenging test environments, such as intersections in the forest (trees absorb wireless signals at 5.9 GHz), the range was better than the previously tested systems. The results demonstrate the benefit of combining NXP's RoadLINK™ solutions with the circuit layout and design of the passive antenna emitters by Delphi."

The field test featured the intelligent roof antenna developed by the automotive supplier, Delphi, based on the NXP and Cohda Wireless RoadLINKTM chipset. An NXP hardware secure element was also used to protect the communications from manipulation and unauthorized tracking or data access.

Andrew Turley, senior director of innovation & V2X program manager, NXP Semiconductors, explains: "The powerful combination of NXP and Cohda Wireless provides auto manufacturers with the secure connections they need to be a part of tomorrow's smart and connected automotive world."

Mr. Turley continued: "The motto of the Audi, NXP partnership is 'Role Model of Innovation & Speed.' Once again, the high standards of performance, reliability and security provided by the NXP and Cohda Wireless RoadLINK™ chipset were demonstrated in challenging trials with a premium automobile manufacturer."


NXP initiates Communicating Cars field trial in Europe in November 2014, together with Siemens and other partners: www.nxp.com/events/communicating-cars

NXP RoadLINK™ products:

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, and consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82billion in 2013. Find out more at www.nxp.com.

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CONTACT: For further press information, please contact: Global/Europe: Birgit Ahlborn +49 170 57 46 12 4 birgit.ahlborn@nxp.com Greater China / Asia: Esther Chang +886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors