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NXP Announces Ultra-Low Power Radio Transceiver Enabling Truly Wireless Earbuds

EINDHOVEN, Netherlands, Feb. 26, 2015 (GLOBE NEWSWIRE) -- At Mobile World Congress in Barcelona, taking place March 2nd-5th, NXP Semiconductors (Nasdaq:NXPI) will demonstrate Near Field Magnetic Induction (NFMI) technology in a truly wireless earbud including wireless audio streaming from ear to ear, using its new NxH2280 NFMI based radio transceiver.

Truly wireless earbuds at work


A photo accompanying this release is available at http://www.globenewswire.com/newsroom/prs/?pkgid=31015

During sports and fitness activities, the wires of today's earbuds are a genuine inconvenience and can potentially be unsafe. Truly wireless earbuds would provide substantially increased user comfort for sport activities, but in general in all situations where wires are undesired and annoying to users.

Currently, existing earbuds still have a wired connection from ear to ear. This is largely due to the fact that sending a stereo audio stream towards two distinct earbuds is not possible with today's 2.4GHz technology. A standard Bluetooth A2DP profile, which supports only point-to-point connections, does not support this use case. Forwarding a high quality audio stream from one ear to the other using reasonable power levels is notoriously difficult using 2.4 GHz technology because most of the signal is absorbed by the human body tissue.

The wireless technology being used to enable truly wireless earbuds is based on Near Field Magnetic Induction (NFMI). NFMI features important properties such as ultra-low power consumption and the ability to create a very reliable network in and around the human body, with both high-quality audio and data streaming supported over small distances (< 1m). An additional integration advantage is also that it requires few external components. NFMI is a short range technology and as such also creates a private network, making it is much less susceptible to interference than 2.4 GHz transceivers.

NXH2280 is NXP's second generation fully integrated single-chip NFMI radio transceiver. Operating from a 1V supply, it only consumes 1.5 mW when audio is streamed in a truly wireless earbud application. The chip supports a maximum bitrate of 596kbps, and can be configured to operate either stand-alone or in conjunction with an MCU. An embedded ultra-low power CoolFluxTM DSP provides flexibility for the implementation of audio processing algorithms. The flexible network stack supports up to 15 devices, low latency communication (< 5ms) and multiple simultaneous audio and data streams in receive and transmit mode. The component is available in a WLCSP package.

During MWC, NXP will be demonstrating the NFMI technology in truly wireless earbuds including wireless audio streaming from ear to ear, at Booth E30 located in Hall 7.

For more information, please contact antoine.delaruelle@nxp.com.

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable Secure Connections for a Smarter World. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the application areas Connected Car, Security, Portable & Wearable and Internet of Things. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at nxp.com.

Forward-looking statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

CONTACT: For further press information, please contact: NXP Semiconductors Europe: Martijn van der Linden +31 6 10914896 martijn.van.der.linden@nxp.com Greater China / Asia: Esther Chang +886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors