NXP Announces Revolutionary New Resonant LLC GreenChip Platform With Industry Leading Low-Load Efficiency and Ease-of-Design

EINDHOVEN, Netherlands, March 16, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI) today announced its new GreenChip power solution, the TEA1916+TEA1995 platform – an innovative and easy-to-design new Resonant LLC solution targeted for desktop PC/AiO, gaming consoles, notebook adapters and large panel TVs.

Building on NXP's success as the market leader in GreenChip power ICs, the new TEA1916+TEA1995 Platform offers very high efficiency over the entire load range, especially at light loads of 10-30% -- easily meeting energy efficiency regulations including Energy Star v6, CoC tier 2, 80+ platinum and EuP Iot6. The TEA1916 additionally features low no-load power below 75mW, meeting and exceeding requirements of Energy STAR, DoE, CoC tier 2, etc. The LLC resonant topology also makes it easier to meet Common Mode Noise requirements and 200% peak power requirements when compared to a flyback topology.

Power supplies built on Resonant LLC topologies are often considered difficult to design and expensive. The TEA1916+TEA1995 Platform reverses this trend. Based on NXP's novel cycle-by-cycle architecture, the TEA1916+TEA1995 Platform provides an easy-to-design power supply that comes closer to flyback with all the added advantages of Resonant LLC. The energy transfer from primary side to the output is controlled every switching cycle, offering a linear relationship between the control parameter and the required output power. The new cycle-by-cycle technology also enables a more accurate burst mode and reduced audible noise.

"At NXP, we constantly strive to innovate. Our next generation GreenChip solution – the TEA1916+TEA1995 Platform – marks another significant step toward providing high efficiency energy savings combined with market leading ease-of-design," said Marcel van Roosmalen, Power Solutions Segment Manager, NXP Semiconductors. "The global drive for energy efficiency underscores the importance of driving low-load efficiency performance that meets and exceeds regulations. With a simple and easy-to-use design offering all the advantages of Resonant LLC, we are making cost-effective, high efficiency power supplies more accessible around the globe."

NXP will highlight its new wireless charging/LLC solutions at booth #1101 during APEC, the Applied Power Electronics Conference and Exposition, held from March 15-19 in Charlotte, North Carolina, USA.


The TEA1916+TEA1995 Platform will be available in Q2 2015.


GreenChip TEA1995 product information: www.nxp.com/pip/TEA1995T

GreenChip TEA1916 product information: www.nxp.com/pip/TEA19161T

NXP Power Selection Guide: www.nxp.com/power

NXP GreenChip Solutions for power and lighting: www.nxp.com/greenchip

For images: http://www.nxp.com/news/press-releases/2015/03/nxp-announces-revolutionary-new-resonant-llc-greenchip-platform-with-industry-leading-low-load-efficiency-and-ease-of-design.html

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at www.nxp.com.

Forward-looking Statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

CONTACT: NXP Semiconductors Europe: Martijn van der Linden +31 6 10914896 martijn.van.der.linden@nxp.com Greater China / Asia: Esther Chang +886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors