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NXP and Qualcomm Collaborate to Accelerate Adoption of NFC and Security in Mobile, Wearable and Internet of Things Devices

EINDHOVEN, Netherlands, May 5, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (Nasdaq:NXPI) today announced that Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, will integrate NXP's industry-leading near field communication (NFC) and embedded secure element (eSE) solutions across Qualcomm® Snapdragon™ 800, 600, 400 and 200 processor based platforms. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc. The agreement will enable the rapid introduction of NFC and eSE on Snapdragon-based devices to meet market demands for increased functionality in a broad range of consumer applications. New reference designs expand the reach of NFC beyond the smartphone and into other applications such as home automation, consumer electronics, automotive, smart appliances, personal computing and wearables.

"NXP's NFC and eSE chipsets are a natural addition to Qualcomm Technologies' platforms, given NXP's expertise in enabling secure transactions," said Dr. Cormac Conroy, vice president, Qualcomm Technologies, Inc. "Qualcomm Technologies is committed to offering the industry's leading silicon technology that not only fuels today's latest devices but also drives and enables innovative new applications and form factors in the future."

The availability of NXP's NFC and eSE solutions for Snapdragon platforms will help accelerate the deployment of secure transactions into a myriad of new applications, such as mobile payments and digital identity for mobile, automotive and Internet of Everything (IoE) segments, complementing Qualcomm Technologies' advanced security solutions. The new offering will feature the NQ220 module, which was derived from the recently launched NXP PN66T module. The NQ220 is designed to enable service providers to easily deliver new applications by simplifying the process of deploying credentials to devices, significantly reducing design costs and time-to-market considerations for mobile wallets and additional applications such as prepaid payment, transit and access control.

"We continue to see the market use and acceptance of NFC grow daily, with new applications being created at an astounding rate. Collaborating with Qualcomm Technologies to provide full eSE and NFC functionality on its industry-leading platforms will further expand this growth potential," said Rafael Sotomayor, senior vice president, NXP Semiconductors. "By working together, each company is able better to focus on its respective area of expertise, ensuring the industry receives a best-in-class, robust, tested and certified solution that can be designed in quickly by OEMs with minimal effort."

The NQ220 reference design is available now through NXP sales channels, please contact NXP sales for further information.

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable Secure Connections for a Smarter World. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the application areas Connected Car, Security, Portable & Wearable and Internet of Things. NXP has operations in more than 25 countries, and posted revenue of $5.65 billion in 2014. Find out more at nxp.com.

Qualcomm and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.

Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.

Forward-looking statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

CONTACT: For further press information, please contact: Europe: Martijn van der Linden +31 6 10914896 martijn.van.der.linden@nxp.com Greater China / Asia: Esther Chang +886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors