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NXP and Stora Enso to Develop Intelligent Packaging Solutions

EINDHOVEN, Netherlands and HELSINKI, Finland, May 28, 2015 (GLOBE NEWSWIRE) -- NXP Semiconductors (Nasdaq:NXPI) and Stora Enso have entered into joint development of intelligent packaging solutions. The development will focus on integrating RFID (Radio frequency identification) into packages for consumer engagement and supply chain purposes. The collaboration will also focus on brand protection and the development of tamper evidence applications. These solutions will benefit both consumers and brand owners.

By using NXP RFID technology such as near field communication (NFC) and ultra-high frequency (UHF), Stora Enso smart packages can be easily tracked and traced through the entire supply chain providing full end-to-end transparency. The integrated technology is also able to detect if the smart package has been tampered with en route to the consumer and, once in the hands of the consumer, can provide additional information and interaction through (the tap of) an NFC-enabled smart phone. This visibility and insight is critical for brands and major manufacturers to ensure their products are being shipped and handled correctly. For consumers the benefits are two-fold; the smart packaging can verify the authenticity of the product and also provide care, usage and other important information via the NFC-enabled tag.

"The co-operation with NXP offers substantial business opportunities for Stora Enso. We have already worked on several concept cases with customers and partners within intelligent packaging. The co-operation with NXP will enable us to bring this development closer to market and provide faster scalability in intelligent paper and board solutions," says Karl-Henrik Sundström, CEO, Stora Enso.

"Our RFID technology in combination with Stora Enso's packaging solutions creates additional value to both consumers and brand owners by providing information and insights along the complete supply chain," said Ruediger Stroh EVP & GM Security & Connectivity, NXP Semiconductors. "The ability of the RFID tag to detect when a package has been compromised and also provide additional product information via NFC truly enables a unique, smart, engaging brand experience and is another example of how security can be broadly implemented to protect our everyday lives."

About Stora Enso

Stora Enso is a leading provider of renewable solutions in packaging, biomaterials, wood and paper on global markets. Our aim is to replace non-renewable materials by innovating and developing new products and services based on wood and other renewable materials. We employ some 27,000 people in more than 35 countries, and our sales in 2014 were EUR 10.2 billion. Stora Enso shares are listed on NASDAQ OMX Helsinki (STEAV, STERV) and Stockholm (STE A, STE R). In addition, the shares are traded in the USA as ADRs (SEOAY) on the International OTCQX over-the-counter market.www.storaenso.com

STORA ENSO OYJ

About NXP Semiconductors

NXP Semiconductors N.V. (Nasdaq:NXPI) creates solutions that enable Secure Connections for a Smarter World. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the application areas Connected Car, Security, Portable & Wearable and Internet of Things. NXP has operations in more than 25 countries, and posted revenue of USD 5.65 billion in 2014. Find out more at nxp.com.

Forward-looking statements

This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

CONTACT: For further press information, please contact: NXP Semiconductors Global/Europe: Birgit Ahlborn +49 170 5746124 birgit.ahlborn@nxp.com Greater China / Asia: Esther Chang 886 2 8170 9990 esther.chang@nxp.com Americas: Hillary Cain +1 408 518 5227 hillary.cain@nxp.com

Source:NXP Semiconductors