EMCORE Expands Laser Diode and Photodiode Optical Chip Offerings for 2.5 Gbps to 12.5 Gbps Telecom and Datacom Applications

ALHAMBRA, Calif., Sept. 27, 2015 (GLOBE NEWSWIRE) -- EMCORE Corporation (NASDAQ:EMKR), a leading provider of Indium Phosphide (InP) optical chips, components, subsystems and systems for the broadband and specialty fiber optics market, announced today that it has expanded its offerings of laser diode and Avalanche Photodiode (APD) optical chips for the high-speed telecom Gigabit Passive Optical Network (GPON) Fiber-To-The-Home (FTTH) market and uncooled digital datacom applications. EMCORE's latest chip series supports 2.5 Gbps to 12.5 Gbps data rate transmission at 1310 and 1550 nanometer (nm) wavelengths.

EMCORE's laser and APD chips are designed and manufactured at the Company's InP wafer fabrication facility in Alhambra, California. The plant features MOCVD reactors for 3x3" or 6x2" wafers, plus stepper, wafer track, RIE (Reactive Ion Etching), diffusion, metal and dielectric deposition, and cleaving and dicing equipment in a class 1,000 clean room space. The facility also functions as EMCORE's anchor for its vertically-integrated manufacturing, supporting laser module, transmitter and receiver products.

The latest G1033 series laser chips include GPON 2.5 Gbps DFB (Distributed Feedback) devices with 1310 and 1550 nm operating wavelength options. Each model features advanced digital chip design with a wide operating temperature range and high optical output power. The chips are Telcordia Technologies® 468 and RoHS compliant. They are specifically designed to perform as the laser source for uncooled digital applications. In addition, EMCORE's chip offering includes high power gain chips ideally suited for tunable lasers and narrow linewidth optical sensing applications.

EMCORE's APD chips include 2.5 Gbps Avalanche Photodiode, as well as 10 Gbps top and bottom illuminated APDs. The 2.5 Gbps APD is specifically designed to target GPON OLT (Optical Line Terminal) and ONU (Optical Networking Unit) applications. The 10 Gbps APD is designed for next-generation PON, as well as other 10 Gbps digital applications. These APDs have high responsivity, very low capacitance and are optimized for high-speed performance.

"This is the first announcement of EMCORE's expanded chip product line that addresses the worldwide demand, particularly in China, for high-data-rate transmission semiconductors for GPON FTTH networks," commented Jeffrey Rittichier, President and CEO of EMCORE. "Our core competency is in optical semiconductors and we are returning to our roots with expanded chip offerings across a large range of applications in the Telecom market. With last year's divestiture of our tunable telecom laser module products, we are poised to become a merchant supplier of high-performance chips," added Rittichier.


EMCORE Corporation designs and manufactures Indium Phosphide (InP) optical chips, components, subsystems and systems for the broadband and specialty fiber optics market. EMCORE was the pioneer in linear fiber optic transmission technology, and today is a leader in optical components, as well as a provider of complete end-to-end solutions for high-speed communications network infrastructures, enabling systems and service providers to meet growing demand for bandwidth and connectivity. EMCORE's advanced optical technologies are designed for cable television (CATV) and fiber-to-the-premise (FTTP) networks, telecommunications and data centers, satellite communications, aerospace and defense, wireless networks, and broadcast and professional audio/video systems. With its world-class InP semiconductor wafer fabrication facility, EMCORE has fully vertically-integrated manufacturing capability and also provides contract design, foundry and component packaging services. EMCORE is headquartered in Alhambra, California, USA with InP wafer fabrication operations in Alhambra, and ISO 9001 certified manufacturing in Alhambra and Langfang, China. For further information, please visit http://www.emcore.com.

Forward-looking statements:

The information provided herein may include forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934, as amended. Such statements include statements regarding EMCORE's expectations, goals or intentions, including, but not limited to, financial performance, reductions in expenses, production schedules, expected customer sales, product features and their benefits, product quality, product performance and EMCORE's executive officers. These forward-looking statements are based on management's current expectations, estimates, forecasts and projections about EMCORE and are subject to risks and uncertainties that could cause actual results and events to differ materially from those stated in the forward-looking statements. Risks and uncertainties that could cause EMCORE's actual results to differ from those set forth in any forward-looking statement are discussed in more detail in EMCORE's SEC filings available at www.sec.gov, including under the headings "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations." Forward-looking statements contained in this press release are made only as of the date hereof, and EMCORE undertakes no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

CONTACT: EMCORE Corporation Gyo Shinozaki Director of Marketing (626) 293-3616 Gyo_shinozaki@emcore.com Media Joel Counter Manager, Corporate Marketing Communications (626) 999-7017 media@emcore.com Investor TTC Group Victor Allgeier (646) 290-6400 vic@ttcominc.com

Source:EMCORE Corporation