BARCELONA, Spain, Feb. 23, 2016 (GLOBE NEWSWIRE) -- Qorvo, Inc. (Nasdaq:QRVO), a leading provider of RF solutions for mobile, infrastructure and defense applications, today announced the expansion of the Company’s RF Fusion™ family of front end solutions. Qorvo’s newest RF Fusion™ front end modules leverage the Company’s industry-leading RF product portfolio, advanced packaging and process technologies, and deep systems-level expertise to integrate all major transmit and receive RF functionality into highly integrated split-band placements.
Eric Creviston, president of Qorvo’s Mobile Products group, said, “Qorvo’s newest RF Fusion™ modules showcase the Company’s industry-leading product portfolio and unique ability to tightly integrate all major RF functionality across all major frequency bands into compact, high-performance placements. With RF Fusion™, Qorvo is providing leading smartphone OEMs the highest level of integration and performance, helping them to simplify and accelerate the launch of their next-generation Rel-12 carrier aggregation- (CA-) capable 4G smartphones and tablets.”
Qorvo’s RF Fusion™ solutions support all major cellular basebands and all major LTE bands to provide leading OEMs a highly compact, scalable source for the entire cellular front end, while speeding an OEM’s time to RF compliance under the most stringent of 3GPP standards. Qorvo offers the industry’s broadest portfolio of high performance RF solutions, combining best-in-class filtering and duplexing, best-in-class switching, and best-in-class power amplifier (PA) efficiency with superior functionality across all major frequency bands.
Qorvo’s newest RF Fusion™ solutions – the QM75001, QM78013 and QM78012 – are split-band placements delivering coverage of 2.3 – 2.7GHz, 1.7 – 2.1GHz, and 698 – 915 MHz, respectively. The solutions are also optimized for superior performance with the industry-leading ET PMICs, and provide complete support for next-generation receive and transmit carrier aggregation functionality.
Qorvo’s RF Fusion™ solutions complement the Company’s expanding family of RF Flex™ solutions, which can be mated with Qorvo’s LowDrift™ and NoDrift™ high performance duplexers to enable flexible and configurable front end systems for mobile devices in emerging markets as well as emerging cellular IoT applications.
About Qorvo’s RF Fusion™ Family of RF Front End Modules
RF Fusion™ HB Module: QM75001 is a multimode multiband module that integrates all major transmit and receive RF functionality for high-frequency band coverage of global cellular networks while delivering best-in-class performance and the industry’s smallest form factor. A subset of the functional content of the successful QM78064 RF Fusion HB Module, the QM75001 integrates multimode, multiband PAs, FDD and TD-LTE capable transmit/receive switches, LowDrift™ filters for bands 38, 40 and 41-wide, and full support for intra-band uplink carrier aggregation, inter-band downlink carrier aggregation, advanced power tracking (APT) and envelope tracking (ET). The highly integrated QM75001 delivers a 35% reduction in board area compared to a discrete solution, and is available in a compact 4.0 x 3.0 x 0.8mm multi-layer laminate substrate placement.
RF Fusion™ MB Module: QM78013 is a multimode multiband module that integrates all major transmit and receive RF functionality for mid-frequency band coverage of global cellular networks while delivering best-in-class performance and the industry’s smallest form factor. The QM78013 integrates multimode, multiband FDD and TD-LTE PAs, mode switching, LowDrift™ band 25 duplexer, a LowDrift™-based multiplexer capable of multi-downlink carrier aggregation for bands 1 and 3 in addition to band 4, along with an antenna switch and coupler. QM78013 PA chains can fully support intra-band uplink carrier aggregation in FDD and TD-LTE bands, such as B1 and B39 respectively, as well as inter-band downlink carrier aggregation, while operating in both advanced power tracking (APT) and envelope tracking (ET) modes. The highly integrated QM78013 delivers a 30% reduction in board area compared to a discrete solution, and is available in a compact 5.5 x 7.7 x 0.875 mm multi-layer laminate substrate placement.
RF Fusion™ LB Module: QM78012 is a multimode multiband module that integrates all major transmit and receive RF functionality for low-frequency band coverage of global cellular networks while delivering best-in-class performance and the industry’s smallest form factor. The QM78012 integrates a multimode, multiband FDD PA, mode switching, multiple LowDrift™ duplexers addressing bands 5/26, 8, 12/17, 20, 28a and 28b, receive aggregation switch, along with an antenna switch. The QM78012 is also designed to reduce harmonic radiation, allowing for improved performance in complex low-band plus mid-band carrier aggregation combinations, while operating in both advanced power tracking (APT) and envelope tracking (ET) modes. The highly integrated QM78012 delivers a 30% reduction in board area compared to a discrete solution, and is available in a compact 5.5 x 7.2 x 1.0 mm multi-layer laminate substrate placement.
Qorvo’s high performance RF solutions simplify design, reduce product footprint, conserve power, improve system performance and accelerate the adoption of carrier aggregation. Qorvo combines deep systems-level expertise, broad manufacturing scale, and the industry’s most comprehensive product and technology portfolio to help leading manufacturers accelerate delivery of next-generation LTE, LTE-A, and IoT products. Qorvo's Core RF solutions set the standard for next-gen connectivity, with unmatched integration and performance at the heart of the connected world.
Qorvo is showcasing the Company’s expanding portfolio of high performance RF solutions for smartphones, tablets, and other high-performance mobile data devices at the 2016 GSMA Mobile World Congress, February 22-25, 2016, in Barcelona.
Qorvo (NASDAQ:QRVO) is a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications. Qorvo was formed following the merger of RFMD and TriQuint, and has more than 7,000 global employees dedicated to delivering solutions for everything that connects the world. Qorvo has the industry’s broadest portfolio of products and core technologies; world-class ISO9001-, ISO 14001- and ISO/TS 16949-certified manufacturing facilities; and is a DoD-accredited 'Trusted Source' (Category 1A) for GaAs, GaN and BAW products and services. For the industry’s leading core RF solutions, visit www.qorvo.com.
Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries.
This press release includes "forward-looking statements" within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements include, but are not limited to, statements about our plans, objectives, representations and contentions and are not historical facts and typically are identified by use of terms such as "may," "will," "should," "could," "expect," "plan," "anticipate," "believe," "estimate," "predict," "potential," "continue" and similar words, although some forward-looking statements are expressed differently. You should be aware that the forward-looking statements included herein represent management's current judgment and expectations, but our actual results, events and performance could differ materially from those expressed or implied by forward-looking statements. We do not intend to update any of these forward-looking statements or publicly announce the results of any revisions to these forward-looking statements, other than as is required under the federal securities laws. Qorvo's business is subject to numerous risks and uncertainties, including variability in operating results, the inability of certain of our customers or suppliers to access their traditional sources of credit, our industry's rapidly changing technology, our dependence on a few large customers for a substantial portion of our revenue, our ability to implement innovative technologies, our ability to bring new products to market and achieve design wins, the efficient and successful operation of our wafer fabrication facilities, assembly facilities and test and tape and reel facilities, our ability to adjust production capacity in a timely fashion in response to changes in demand for our products, variability in manufacturing yields, industry overcapacity and current macroeconomic conditions, inaccurate product forecasts and corresponding inventory and manufacturing costs, dependence on third parties and our ability to manage channel partners and customer relationships, our dependence on international sales and operations, our ability to attract and retain skilled personnel and develop leaders, the possibility that future acquisitions may dilute our shareholders' ownership and cause us to incur debt and assume contingent liabilities, fluctuations in the price of our common stock, additional claims of infringement on our intellectual property portfolio, lawsuits and claims relating to our products, security breaches and other similar disruptions compromising our information and exposing us to liability, the impact of stringent environmental regulations, and the impact of the integration of Qorvo. These and other risks and uncertainties, which are described in more detail in Qorvo's 8K and other reports and statements filed with the Securities and Exchange Commission, could cause actual results and developments to be materially different from those expressed or implied by any of these forward-looking statements.
Investor Relations: Doug DeLieto VP, Investor Relations, Qorvo W: 1-336-678-7088 Marketing Manager: Abhiroop Dutta Strategic Marketing Manager, Qorvo E: email@example.com W: +1 336-678-8074