TAINAN, Taiwan, April 19, 2016 (GLOBE NEWSWIRE) -- Himax Technologies, Inc. (Nasdaq:HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced mass production of its in-cell single-chip touch and display driver integrated (“TDDI”) solution, HiSIT™, for a leading Chinese smartphone customer. By featuring in-cell touch with the HiSIT™ TDDI solution, Himax’s leading Chinese smartphone customer can offer consumers thinner, lighter and sleeker devices with better touch screen performance and longer battery life to enhance user experience.
"We are pleased to start volume shipment of our innovative TDDI solution to this leading Chinese smartphone customer,” stated Jordan Wu, President and CEO of Himax Technologies, Inc. “In-cell display with TDDI is rapidly becoming the preferred choice for end product customers’ new high-end devices. The volume shipment record validates our leading pioneer position in this new exciting TDDI market. Furthermore, expanding long-term supplier relationships with our smartphone customers from driver ICs to include both on-cell and in-cell solutions demonstrates our ability to fulfill the increasingly complicated demands of leading mobile device manufacturers. Our competitive edge stems from our advanced DDIC design, reputable delivery record, and a comprehensive product portfolio. The announcement today is just the beginning of our growth of in-cell TDDI product line. We expect meaningful contribution from TDDI. Additionally, we anticipate more design-wins to enter mass production at several Chinese and Korean smartphone customers and panel makers this year.”
About Himax Technologies, Inc.
Himax Technologies, Inc. (NASDAQ:HIMX) is a fabless semiconductor solution provider dedicated to display imaging processing technologies. Himax is a worldwide market leader in display driver ICs and timing controllers used in TVs, laptops, monitors, mobile phones, tablets, digital cameras, car navigation, virtual reality (VR) devices and many other consumer electronics devices. Additionally, Himax designs and provides controllers for touch sensor displays, in-cell Touch and Display Driver Integration (TDDI) single-chip solutions, LED driver ICs, power management ICs, scaler products for monitors and projectors, tailor-made video processing IC solutions, silicon IPs and LCOS micro-displays for augmented reality (AR) devices and heads-up displays (HUD) for automotives. The Company also offers digital camera solutions, including CMOS image sensors and wafer level optics which are used in a wide variety of applications such as mobile phone, tablet, laptop, TV, PC camera, automobile, security, medical devices and Internet of Things. Founded in 2001 and headquartered in Tainan, Taiwan, Himax currently employs around 1,900 people from three Taiwan-based offices in Tainan, Hsinchu and Taipei and country offices in China, Korea, Japan and the US. Himax has 2,764 patents granted and 566 patents pending approval worldwide as of December 31, 2015. Himax has retained its position as the leading display imaging processing semiconductor solution provider to consumer electronics brands worldwide.
Forward Looking Statements
Factors that could cause actual events or results to differ materially include, but not limited to, general business and economic conditions and the state of the semiconductor industry; market acceptance and competitiveness of the driver and non-driver products developed by the Company; demand for end-use applications products; reliance on a small group of principal customers; the uncertainty of continued success in technological innovations; our ability to develop and protect our intellectual property; pricing pressures including declines in average selling prices; changes in customer order patterns; changes in estimated full-year effective tax rate; shortages in supply of key components; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; our ability to collect accounts receivable and manage inventory and other risks described from time to time in the Company's SEC filings, including those risks identified in the section entitled "Risk Factors" in its Form 20-F for the year ended December 31, 2015 filed with the SEC, as may be amended.
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Source:Himax Technologies, Inc.