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SOITEC : SOITEC ANNOUNCES WITHDRAWAL OF SILICON GENESIS' PATENT LAWSUIT

BERNIN (GRENOBLE), France, May 23, 2016 (GLOBE NEWSWIRE) -- Soitec (Euronext), a world leader in manufacturing semiconductor materials for the electronics industry, today announced that on May 18, 2016, Silicon Genesis Corporation (SiGen) filed a motion to terminate the investigation by the U.S. International Trade Commission (ITC) in its entirety on the basis of the withdrawal of its complaint directed to silicon-on-insulator (SOI) wafers sold and imported into the United States by Soitec (see press release dated December 9, 2015).

A robust patent portfolio is a key part of Soitec's business model, which protects both manufacturing and licensing operations. The company uses its state-of-the-art innovative technologies to enhance the performance and energy efficiency of semiconductors. Today, Soitec's IP portfolio contains more than 3,000 patents covering multiple technologies for manufacturing engineered wafers - mainly SOI wafers - which are used in making leading-edge products. SOI technology is critical for the global electronics chip industry, with SOI based chips being used in smart phones, tablets, servers, cars and networks.

About Soitec: Soitec (Euronext) is a world leader in designing and manufacturing innovative semiconductor materials. The company uses its unique technologies and semiconductor expertise to serve the electronics and energy markets. With 3,600 patents worldwide, Soitec's strategy is based on disruptive innovation to answer its customers' needs for high performance, energy efficiency and cost competitiveness. Soitec has manufacturing facilities, R&D centers and offices in Europe, the U.S. and Asia. For more information, please visit www.soitec.com and follow us on Twitter: @Soitec_EN



International Media Contact
Camille Dufour
+33 (0)6 79 49 51 43
camille.dufour@soitec.com


Investor Relations
Steve Babureck
+1 858 519 6230
or +33 (0)6 16 38 56 27 steve.babureck@soitec.com

Soitec press release in PDF http://hugin.info/143589/R/2014730/746957.pdf

HUG#2014730

Source:SOITEC