HILLSBORO, Ore., June 16, 2016 (GLOBE NEWSWIRE) -- FEI (NASDAQ:FEIC) announced today the release of three new tools for process control and defect/failure analysis in advanced semiconductor manufacturing. Two of the tools are specifically targeted at the 7nm node, and all are designed to allow manufacturers to address critical production issues with industry-leading time-to-data, throughput and low cost-per-sample.
“Perhaps more than any other industry, time is money in advanced semiconductor manufacturing,” said Rob Krueger, vice president and general manager of FEI’s Semiconductor Business. “The time required to analyze a sample affects the cost-per-sample directly, but even more importantly, the time required to answer critical production questions can reduce losses and increase production of the entire process. These new tools are the first on the market to allow fast, automated analysis of critical structures that are 7nm and smaller, enabling manufacturers to develop and scale new processes faster, and get new products to market sooner and more profitably than their competitors.”
The Helios™ G4 DualBeam EXL is a flexible, full-wafer, in-lab or in-fab DualBeam (focused ion beam/scanning electron microscope – FIB/SEM) system. In addition to performing the full range of sectioning, imaging and analyzing functions typical of DualBeam applications in semiconductor manufacturing, it is the only commercially-available full-wafer system in the market today capable of preparing transmission electron microscope (TEM) samples as thin as 7nm. The new Phoenix FIB column and monochromated Elstar SEM column deliver more precise milling with less surface damage and higher resolution imaging. Automation greatly reduces the difficulty, while also improving the speed and reproducibility of the sample preparation process.
The Metrios™ DX TEM incorporates new high-speed X-ray compositional analysis in conjunction with fully-automated workflows to improve defect analysis throughput by up to 50 percent. An automated aberration corrector improves low-voltage operation to minimize beam damage in ultrathin samples without sacrificing imaging resolution. Automated connectivity to upstream preparation tools minimizes operator interaction with the sample and improves data integrity. The Metrios DX is the only commercially-available fully-automated TEM in the market with the resolution required for process control and root cause analysis at the 7nm node.
The ExSolve™ 2 WTP is a dedicated, automated full-wafer DualBeam TEM sample preparation system capable of creating thin samples for 10nm and 14nm processes. This second generation ExSolve offers a 40 percent improvement in sample thickness, 50 percent better placement accuracy relative to its predecessor, while delivering 25 percent reduction in capex relative semi-automated/manual techniques. Automated sample preparation with ExSolve is two to three times faster than manual or small DualBeam procedures. The new ExSolve also adds semi-automated defect analysis capability for certain surface defects.
More information about FEI’s new solutions for advanced semiconductor manufacturing, please visit http://fei.com/advanced-semiconductor-manufacturing.
FEI Company (Nasdaq:FEIC) designs, manufactures and supports a broad range of high-performance microscopy workflow solutions that provide images and answers at the micro-, nano- and picometer scales. Its innovation and leadership enable customers in industry and science to increase productivity and make breakthrough discoveries. Headquartered in Hillsboro, Ore., USA, FEI has over 2,800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.
FEI Safe Harbor Statement
This news release contains forward-looking statements that include statements regarding the performance capabilities and benefits of the Helios G4 EXL, Metrios DX TEM, and ExSolve 2 WTP. Factors that could affect these forward-looking statements include but are not limited to our ability to manufacture, ship, deliver and install the tools, solutions or software as expected; failure of the product or technology to perform as expected; unexpected technology problems and challenges; changes to the technology; the inability of FEI, its suppliers or project partners to make the technological advances required for the technology to achieve anticipated results; and the inability of the customer to deploy the tools or develop and deploy the expected new applications. Please also refer to our Form 10-K, Forms 10-Q, Forms 8-K and other filings with the U.S. Securities and Exchange Commission for additional information on these factors and other factors that could cause actual results to differ materially from the forward-looking statements. FEI assumes no duty to update forward-looking statements.
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