AUSTIN, Texas--(BUSINESS WIRE)-- Eight companies will be demonstrating significant progress advancing design flow interoperability at the 17th Si2 Conference. The Conference will be held on October 9, 2012, at the Network Meeting Center-Techmart, Santa Clara, CA. These companies will be showing how Si2 standards developed by the various Si2 coalitions can provide innovative approaches to critical IC design flow issues. The agenda for the full conference is located here: http://www.si2.org/?page=1583. Following are descriptions of each company’s demonstrations, as provided by them.
Cadence Design Systems: will demonstrate an integrated Mixed-signal Implementation flow, leveraging OpenAccess as the unified database for both analog and digital parts of a design, enabling seamless exchange of design data and constraints between industry-leading Virtuoso and Encounter platforms. Learn how to overcome limitations of “black-box” methodology using OpenAccess to enable transparency among analog and digital domains form floorplanning through chip integration and signoff, resulting in optimal floorplan on smaller chip area, fewer iterations among analog and digital designers, better silicon predictability by more accurate signoff, and easier ECO.
ICScape: will demonstrate its complete, integrated custom analog design and implementation flow that is based on OpenAccess™ and iPDK™. ICScape’s AMS suite is in its sixth generation, and over the years has seen 100s of designs through silicon. Included in the suite are full-featured schematic and layout editors, a fast multi-threaded SPICE simulator, a fast mixed-signal simulator, DRC, LVS solutions and RC extraction with built-in analysis capabilities.
Mentor Graphics: will demonstrate Calibre RealTime in the SpringSoft Laker Custom Design Environment, which provides un-equaled engineer productivity for advanced nodes by providing full sign-off DRC feedback during design creation. We will also demonstrate Calibre’s standard ability to read OpenAccess databases for Physical, Electrical, and DFM applications.
MicroMagic: will be demonstrating the MAX-3D Design Suite used to plan and lay out today’s complex wafer-stack and interposer multi-technology designs. The design suite includes:
MAX-3D for true 3-dimensional layout, supporting multiple distinct technology files for Through-Si Via 3D wafer-stack and interposer design.
MAX-3D Path Finder, to explore viability of interposer or stacked-die implementations.
MAX-3D TSV Placer for automatically locating, optimizing and placing TSVs.
All of the Micro Magic tools support OpenAccess.
Pulsic: will be demonstrating the Pulsic Planning Solution, the only complete integrated hierarchical planning solution for custom designs. See how the Pulsic Planning Solution solves today’s toughest design challenges with intelligent, signal aware pin placement and optimization; interactive guide driven bus and repeater planning and insertion; top level signal planning with matched topology for multiple nets; guide driven, easy to use, hierarchical power planning technologies. Whether you are designing custom digital, custom ASIC, FPGA, microprocessors, Memory, LCD/LED, or other ASSP designs, Pulsic can help you get predictable designs to tape out faster and more efficiently than ever before.
Si2: will demonstrate the latest version of Si2oaD, the OpenAccess Debug utility developed by the Si2 engineering staff, along side the latest versions of oaScript, the OpenAccess Scripting Language. Learn how Si2oaD's latest release has greatly increased its ease of use. The Si2oaD demonstration will also include its use inside oaScript, allowing for real-time debugging. Si2oaD currently works from the command line, in all oaScripting languages, in the GNU C++ debugger.
Si2 will also show a new feature of the Open Parasitic Extraction (OPEX) project. The new feature will allow end-users to have on-line and on-demand access to OPEX process parameter info with just using a browser from any device which has access to the internet. OPEX addresses the problem of lack of uniformity across the industry in describing the same physical quantity and relationships.
SpringSoft: will be demonstrating Laker³, the third-generation of the most widely-used interoperable custom design system. Laker³ is built on OpenAccess and optimized for performance and interoperability for design flows at 28nm and below.
Synopsys: will demonstrate Galaxy™ IC Compiler Custom Co-Design running various OpenAccess tools from Si2 including oaScript (Tcl, Python, Perl and Ruby), oaDebug and oaFigSet. Custom Designer is built natively on OpenAccess to provide the industry’s most open, standards-based custom design solution.
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured, in order to speed time-to market, reduce costs, and meet the challenges of sub-micron design. Now in its 24th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world. See www.si2.org
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Silicon Integration Initiative
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Source: Silicon Integration Initiative