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Research and Markets: Texas Instrument DLP PicoTM projector family - Reverse Costing Report

DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/4bg2cx/texas_instrument) has announced the addition of the "Texas Instrument DLP® PicoTM projector family - Reverse Costing Report" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of three DLP® Pico projectors (DLP® nHD, DLP® 0.17 HVGA and the DLP® 0.3 WVGA) supplied by Texas instrument.

Featuring a nHD resolution (640 x 360) and packaged in a small ceramic housing (16mm x 6.9mm), The DLP nHD, is the thinnest and the smallest DLP Pico projector. It is ideally suited for mobile application and was extracted from the Galaxy beam phone.

The DLP1700, features a Half-VGA Resolution (480 x 320), and has a 0.17-Inch Micromirror Array Diagonal, while the DLP3000 features a Wide-VGA Resolution (608 × 684) and has a 0.3-Inch Micromirror Array Diagonal.

Both of them, are ideally suited for Pocket Projectors and were extracted from Optima devices.

Key Topics Covered:

Overview / Introduction

Texas instrument Company Profile

Physical Analysis

- Synthesis of the Physical Analysis

- DLP® 0.17 HVGA: Package Characteristic

- DLP® 0.17 HVGA: Package Opening

- DLP® 0.17 HVGA: Package Cross Section

- DLP® 0.17 HVGA: Process technology

- DLP® 0.17 HVGA: Micromirrors-Pictures

- DLP® 0.3 WVGA: Package Characteristics

- DLP® 0.3 WVGA: Package Opening

- DLP® 0.3 WVGA: Package Cross Section

- DLP® 0.3 WVGA: Process technology

- DLP® 0.3 WVGA: Micromirrors-Pictures

- DLP® nHD: Package Characteristics

- DLP® nHD: Package Opening

- DLP® nHD: Package Cross Section

- DLP® nHD: Process technology

- DLP® nHD: Micromirrors-Pictures

Manufacturing Process Flow

- Wafers Fabrication Units

- Front-End Manufacturing Process Flow:

- Back-End Packaging Process Flow

- Back-End Packaging Assembly Unit

Cost Analysis

- Synthesis of the Cost Analysis

- CMOS Wafer Front-End Cost

- CMOS Die Cost

- MEMS Wafer Front-End Cost

- MEMS Front-End Cost per Steps

- MEMS Front-End Cost per Equipment

- MEMS Front-End Cost per Consumables

- MEMS Die Cost

- Back-End : Package Cost

- Back-End : Package Cost Per Steps

- Manufacturing Cost

Estimated Manufacturer Price

For more information visit http://www.researchandmarkets.com/research/4bg2cx/texas_instrument

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Telecommunications and Networks

Source: Research and Markets