DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/8l78bn/advanced) has announced the addition of the "Advanced Packaging: 3D Glass & Silicon Interposers 2012" report to their offering.
Why and how 2.5D integration will impact more than 15% of the IC substrate business by 2017
2.5D AND 3D INTEGRATION IS SET TO BE A LONG-LASTING TREND IN THE SEMICONDUCTOR INDUSTRY
After meeting with swift commercial success on a few initial applications, including MEMS, sensors and power amplifiers, 3D integration has been on everyone's mind for the past five years. However, once the initial euphoria faded, and despite technical developments which assured most observers that mass adoption of 3D was not out of reach, some unanticipated technical and supply chain hurdles were revealed that were higher than anticipated. It was then that 2.5D integration by means of 3D glass or silicon interposers was revealed by experts as a necessary stepping-stone to full 3D integration. Our first report on 3D interposers and 2.5D integration was in 2010; at that time, we listed the various applications of this technology trend and its drivers, and we showed that glass and silicon interposers were expected to become high-volume necessities, rather than just high-performance solutions for a few niche applications.
In this 2012 edition of that report, we provide more evidence of our findings from two years ago: after refining the applications and drivers of 3D interposers and 2.5D integration with the use of detailed forecasts, Yole Développement estimates that far from being a stepping-stone technology to full 3D integration, 3D interposers and 2.5D integration is emerging as a mass volume, long-lasting trend in the semiconductor industry.
THE BUSINESS GENERATED BY THE 2.5D INTERPOSER SUBSTRATE WILL GROW RAPIDLY, TO AN EXPECTED TOTAL VALUE OF $1.6B IN 2017
Glass & silicon 2.5D interposers are already a commercial reality in MEMS, Analog, RF & LED applications on 150mm / 200mm, supported by the relatively exotic' infrastructures of MEMS players such as IMT-MEMS, Silex Microsystems, DNP, and DALSA / Teledyne, and structured glass substrate suppliers like HOYA, PlanOptik, NEC / Schott, and tecnisco. On 300mm, the infrastructure and market for 2.5D/3D interposers has hardly emerged as of 2012, but nevertheless we expect that in 2017, over 2 million 300mm wafers will be produced in that year alone. We also expect that the silicon or glass type of 2.5D interposer substrate will impact more than 16% of the traditionally organic-made' IC package substrate business by 2017, with almost $1.6B revenues generated by then.
IS COST REALLY AN ISSUE IN THE LONG TERM?
Significant investments began in 2012, with more than $150M capex expected and driven by both wafer foundries (TSMC, Global Foundries) and OSATs (Amkor, ASE). No one, especially in Taiwan, wants to be left behind in this high-growth story, as it clearly appears to be a central piece of the increasing middle-end business and infrastructure, halfway between the front-end silicon foundries and the back-end assembly & test facilities.
The question now is: can anyone build a profitable business case to support the growth of 2.5D/3D interposers? In other words, how long will it take for investing companies to be paid back, while offering affordable prices to their customers? Yole expects the expansion model of this new technology trend to follow a traditional path: first, high-value modules are expected to use the technology to offer unprecedented high performance, followed by higher volume applications.
The nice thing about 2.5D interposers is that they do not only allow for unprecedented performance: they can do so for a much lower cost than any competing technology. Through a few cost cases in this report, we demonstrate that cost can be a strong adoption driver too. No, silicon and glass interposers are not additional dead pieces of hardware in the package -- on the contrary, they are among the top five key elements of the semiconductor roadmap for the decade 2010-2020.
KEY FEATURES OF THE REPORT
- Detailed view, by product and device type, of the key applications driving the commercialization of 2.5D interposer substrates
- Detailed 2011 - 2017 market forecast in both unit and wafer shipments, including a revenues analysis of Middle-end to Back-end assembly & test-related activities
- Overview of the positioning of different key players, and an understanding of supply chain challenges happening between the different business models in place
- Technology trends & roadmaps, including the topic of glass interposers and the possible move to large PANEL area processing, leveraging LCD or PCB infrastructures
- Detailed cost structure of several different 2.5D interposer packages: system-level evaluation of several different case scenarios, analyzing the expected cost decrease trend over five years
- Analysis of the required investment in terms of capex between 2011 - 2017
Key Topics Covered:
1. Scope of the report , definitions and background
2. Executive summary
3. Supply chain analysis
4. Market forecasts
5. Applications and drivers
6. Technologies and roadmaps
7. Technology alternatives
8. 3D Interposers and 2.5D modules
9. Capex investment forecasts
Companies Mentioned: Click the link below to view the full list of companies featured in this extensive report
For more information visit http://www.researchandmarkets.com/research/8l78bn/advanced
Source: Research and Markets