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Research and Markets: Deep Reactive Ion Etching: Equipment & Materials Market Report 2012 - NUmber of Wafers Processed with DRIE Will See 5X growth 2011 - 2017

DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/m3vl8b/deep_reactive_ion) has announced the addition of the "Deep Reactive Ion Etching: Equipment & Materials Market 2012" report to their offering.

The Number of Wafers Processed with DRIE Will See 5X Growth 2011 - 2017

DRIE Is Becoming More and More Popular

The Deep Reactive Ion Etching (DRIE) is a structuration process originally used for MEMS. This process enables achieving etch depths of 100s of micrometers with almost vertical sidewalls with very high aspect ratio (> 50:1 in some cases). The process was first developed by Robert Bosch, and thus it is also called the BOSCH process and is used whenever high aspect ratios are targeted. SPP, the equipment manufacturer,obtained a license from Bosch to exploit the technology.This agreement has led to incredible growth of the DRIE market. First used for production of accelerometers, the process is used today for production of (some) ink jet-heads, pressure sensors,gyroscopes, micro phones and micro actuators (e.g.MEMS auto-focus). But the use of the process has become popular outside of the MEMS world, for Advanced Packaging applications.

The Report Describes the Following Points:

- DRIE applications: MEMS, Advanced Packaging, Power Devices

- 2011-2017 DRIE equipment forecast by application, wafer size in chambers, US$M value

- Chemistry forecast

- DRIE vendors profiles

- Market shares

- New innovative applications (micro gears, auto-focus, microfluidics, resonators)

Key Features of the Report:

The report will analyze the technical & economic evolution of the DRIE technology. It will give:

- 2011-2017 Market Forecasts for DRIE in $M value and number of equipment

- - By applications (MEMS, Advanced Packaging, Power)

- - 2011-2017 Market Forecast for DRIE chemistry

- Overview of the different DRIE approaches

- Description of the applications for DRIE with main characteristics

- Equipment players market shares and competitive information

Competition is strengthening as applications are burgeoning

The DRIE process was first used for accelerometer and gyroscope production for automotive applications. Although DRIE continues to be used for accelerometers, the growth is no longer restricted to this application. Continuous growth for MEMS accelerometers was observed in 2011. Although the device price pressure is very important in smartphones, further penetration on feature-phones was observed and new markets appeared (such as tablets). Moreover, the market for consumer gyroscopes skyrocketed in 2011. Indeed most handset OEMs adopted gyroscopes for their flagship smartphones or tablets. 3-axis gyroscopes will be the hottest MEMS product in the coming years as the penetration of gyroscopes will keep increasing. Today, most of the inertial MEMS have a comb-drive structure. Therefore, DRIE needs to be used for micromachining. From 2014, combo sensor integration (a combination of several inertial sensors in one single package) will be largely adopted. This will drive the growth of DRIE for inertial MEMS. The year 2012 also see new MEMS devices (e.g. MEMS-based auto-focus, offering smaller size, quicker actuation, lower power consumption and better image quality) that will also use DRIE.

From 2011 to 2017, the number of DRIE-processed wafers will jump from 5.4M to more than 27M (all wafer sizes).

Who should buy the report

DRIE vendors

- Identify and evaluate DRIE markets with market size & growth

- Analyze the threats and opportunities

- Monitor and benchmark your competitor's advancements

Foundries & chip manufacturers

- Get an overview of the DRIE technologies

- Spot the important DRIE technologies in the future for your application

Financial & Strategic investors

- Understand the main market dynamics and main technological trends

- Get the list of the key players

Key Topics Covered:

  1. Scope of the report & definitions
  2. Executive Summary
  3. Introduction
  4. DRIE technologies overview
  5. Global DRIE 2011-2017 market forecast
  6. DRIE vendors market s hares 2011
  7. Application focus for DRIE technology
  8. DRIE profiles
  9. Conclusion
  10. Annexes

Companies Mentioned

- AAC Acoustic

- Air Liquide

- Air Product

- Akustica

- Analog Devices

- Bosch

- DuPont

- Epson

- Fairchild

- FujiElectric

- Hitachi High-Tech

- Hua-Hong NEC

- Invensense

- Kodak

- Knowles

- LAM Research

- Maxis

- Memjet

- Nippon Kayaku

- Oxford Instrument

- Microchem

- Panasonic Factory

- Shin-Etsu

- ST Micro

- Panasonic

- Renesas

- SPTS

- Tokyo Electron

- ULVAC

- Ycchem

For more information visit http://www.researchandmarkets.com/research/m3vl8b/deep_reactive_ion

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor

Source: Research and Markets