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Research and Markets: Thin Wafers, Temporary Bonding Equipment & Materials Market 2012: Memory, Logic, Power Devices & Image Sensors will Drive Mwrket

DUBLIN--(BUSINESS WIRE)-- Research and Markets (http://www.researchandmarkets.com/research/tw23tv/thin_wafers) has announced the addition of the "Thin Wafers, Temporary Bonding Equipment & Materials Market 2012" report to their offering.

Memory, Logic, Power Devices & Image Sensors markets will drive the thin wafers market and related handling technologies

WITH ALMOST ¾ OF THE TOTAL NUMBER OF WAFERS EXPECTED TO BE THINNED BY 2017, TEMPORARY BONDING MARKET WILL INCREASE IN THE COMING YEARS

This Yole Développement report describes why thinner wafers will be needed in the future, especially for consumer applications. Indeed, consumer electronics is a big driver for smaller, higher-performing, lower-cost device configurations for use in various applications, such as memory and wireless devices.

These new configurations, in turn, are pushing demand for thin ( 80M 12'' eq. wafers.

Applications are also described in the report. The 2012 market drivers for thin wafers are 3D ICs, and also Power Devices and CIS BSI for ultra-thin wafers. Indeed, the BSI application is the big driver for ultra thin wafers; this application is currently booming. 2011 was a big year for 300 mm wafer bonding tools, thanks to BSI. This application requires ultra thin layers ( 2015.

Temporary bonding implies know-how in process and chemistry, and an understanding of the final application requirements. Temporary bonding is a complex technology, requiring an interface material (sometimes called the Magic material) that is strong enough to withstand post-processing but which can be easily removed afterwards. As the main concern for temporary bonding materials (wax, tape or glue) is temperature stability, the material must be strong enough to withstand processing steps (metallization, etching, grinding). Another issue is the choice of carrier material. Carrier lifetime depends on its capability to withstand steps such as grinding, etc., and carrier lifetime should be at least tens of times, though this is not yet the case today.

WHAT'S NEW COMPARED TO THE 2011 REPORT?

Compared to the 2011 installment, this report now contains:

Updated thin wafers forecast 2011-2017

- By application

- By thickness

- By wafer size

Updated players

- New chapter on Power MOSFETs

- Why thin wafers for power

- Players

- Roadmap

New chapter on Photovoltaic

- Why thin wafers for PV

- Players

- Roadmap

New chapter on temporary bonding

- Players

- Technologies

- Applications

- Challenges

Equipment forecast 2011-2017

- In units

- In US$

- By application

Temporary chemistry forecast 2011-2017

OBJECTIVES OF THE REPORT

Provide an understanding of the thin wafers application:

- Overview of thin wafers applications: MEMS, CMOS Image Sensors, Memory, Power Devices, RF Devices, LEDs, Interposers, Photovoltaics

- Thin wafers roadmap

Present market forecasts for thin wafers:

- 2011-2017 Market Forecast in units and US$ for thin wafers

- Detailed forecasts by application, wafer size and thickness

Analyze wafer thinning trends, with a focus on temporary bonding

Market Forecasts for temporary bonding in US$ value and number of equipment:

- By application

- By wafer size

Market Forecast for temporary bonding chemistry

Overview of the different temporary bonding approaches, i.e.:

Without carrier:

- TAIKO

- DoubleCheck Semiconductors

With Carrier:

- UV laser released

- Electrostatic

- Thermal release

- Mechanical release

- Chemical release

Temporary bonding trends

- Thinning trends

- Dicing trends

- Description of the applications for temporary wafer bonding, including main characteristics and challenges

Key Topics Covered:

  1. Why this report
  2. What is new compared to 2011 report
  3. List of companies mentioned in the report
  4. Executive summary
  5. THIN WAFERS
  6. 2011-2017 thin wafer market forecasts
  7. Description of applications
  8. THIN WAFERS HANDLING
  9. Temporary bonders/Carriers/Materials forecast
  10. Thin wafer handling: the different solutions
  11. Final conclusions

Companies Mentioned: Click the link below to view the companies featured in this extensive report

For more information visit http://www.researchandmarkets.com/research/tw23tv/thin_wafers

Research and Markets
Laura Wood, Senior Manager.
press@researchandmarkets.com
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Semiconductor

Source: Research and Markets