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New Intelligent Systems Conference Featured at Sensors Expo 2013

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SAN CLEMENTE, Calif., April 12, 2013 (GLOBE NEWSWIRE) -- With embedded devices and machine-to-machine communication becoming more intelligent and advanced technology rapidly impacting every facet of daily life, The RTC Group is launching its Intelligent Systems Conference & Pavilion (ISCP) at the 2013 Sensors Expo & Conference -the ideal location to combine intelligent sensing technology with embedded computing, and intelligent systems.

Opening June 5, 2013 at the Rosemont Convention Center near Chicago's O'Hare International Airport, ISCP will target: Intelligent Systems, Embedded Electronics, and Medical Device Deployment. Multiple conference sessions provide cutting edge topics for attendees, such as:

  • "Understanding the Medical Device Procurement Process by the Hospitals", a panel led by Dr. Dale Nordenberg, Executive Director/Medical Device Innovation, with the Safety and Security Consortium, MDISS
  • "Comparison of Intelligent Open Platform Software Yocto Project & Windows Embedded Standard" by Sean D. Liming, Author, Instructor, and Consultant, Annabooks
  • "How 3D Printing Technology Accelerates the Product-to-market Process" by Daniel Searle, Business Development Manager, Solid Concepts
  • "The Future of Medical Electronics: Handheld, Wearable and Diagnostic" by Ritesh Tyagi, Senior Director of Product Marketing, Renesas Technology

ISCP creates a productive environment for designers, developers, hardware manufacturers and software solution providers all under one roof. It will facilitate interaction, an exchange of ideas and collaboration of solutions to get ahead. The technical tracks and pavilion provide valuable face-to-face opportunities for industry professionals not found elsewhere.

With over 4,000 attendees last year at Sensors Expo, this new ISCP showcase will allow designers and engineers in both industries to team-up in a dynamic way without having to visit multiple venues on separate days. Aaron Foellmi, Vice President of The RTC Group, states: "The connections between sensor technology and embedded intelligent systems continue to expand the device market, and ISCP looks to expand our coverage at the Sensors Expo to reflect this growing reality."

Exhibits at ISCP/Sensors Expo is free to attend. Single-day conference passes are $295, with a full conference pass just $495. Guest Registration is now open at: www.issconference.com.

Vendors needing to stay on the forefront of the market and in front of the engineering community, should contact ISCP Event Sales Manager, Jasmine Formanek at 949-226-2004 / jasminef@rtcgroup.com. Don't miss securing a Pavilion exhibit spot; it is a unique spotlight to gain connections for increased market share.

About the RTC Group

For more than 27 years The RTC Group has focused its attention on providing the most efficient, cost-effective tools for sales and marketing in the computer and electronic design marketplace. This singular passion has made RTC one of the leading media and marketing companies in the embedded and electrical design community. The RTC Group also produces the ISS Real-Time & Embedded Computing Conference (RTECC), RTC magazine, COTS Journal, MEDS magazine, and IntelligentSystemsSource.com.

CONTACT: For more information contact: Sally Bixby, Senior Event Director (503) 274 8005 sallyb@rtcgroup.com

Source: TheRTC Group